203L5 Datasheet PDF - STMicroelectronics

Description
This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)*Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved.

FEATUREs
â–  Ultra low top and bottom junction to case thermal resistance
â–  RDS(on) * Qg industry benchmark
â–  Extremely low on-resistance RDS(on)
â–  Very low switching gate charge
â–  Fully encapsulated die
â–  100% matte tin finish (in compliance with the 2002/95/EC european directive)
â–  High avalanche ruggedness
■ PolarPAK® is a trademark of VISHAY

APPLICATION
â–  Switching applications