AT25FF161A-DWF Datasheet PDF - Dialog Semiconductor

Features
• Voltage Range: 1.65 V - 3.6 V
• 16 Mbit (2M x 8) Flash Memory
• Serial Peripheral Interface (SPI) compatible
   - Supports SPI modes 0 and 3 (1-1-1)
   - Supports dual output operation (1-1-2)
   - Supports quad output operation (1-1-4)
   - Supports quad I/O operation (1-4-4)
   - Supports XiP operation (1-4-4, 0-4-4)
• 133 MHz maximum operating frequency
   - Clock-to-output of 8 ns
• Flexible, optimized erase architecture for code + data storage applications
   - Uniform 4-kByte block erase
   - Uniform 32-kByte block erase
   - Uniform 64-kByte block erase
   - Full chip erase
• Flexible non-volatile block protection
• 1 x 128-byte factory-programmed unique identifier
• 3 x 128-byte, One Time Programmable (OTP) security registers
• Flexible programming
   - Byte/Page program (1 to 256 Bytes)
   - Sequential program mode capability
• Erase program suspend resume
• Software controlled Reset and Terminate commands
• Hardware reset option (via HOLD pin)
• JEDEC hardware reset
• Non-volatile status register configuration option
• JEDEC standard manufacturer and device ID read methodology
• Serial Flash Discoverable Parameters (SFDP) version 1.6
• Low power dissipation:
   - 30 µA standby current (typical)
   - 8.2 µA Deep Power-Down (DPD) current (typical)
   - 5 - 7 nA Ultra Deep Power Down (UDPD) current (typical)
   - 8.6 mA active read current (1-1-1 — 108 MHz)
   - 9.2 mA program current
   - 10.2 mA erase current
• User configurable and auto I/O pin drive levels
• Endurance
   - 100,000 program/erase cycles
• Data Retention
   - 20 years
• Temperature Range
   - -40 °C to +85 °C
• Industry standard green (Pb/Halide-free/RoHS Compliant) Package Options
   - 8-lead SOIC (150-mil) including silver free
   - 8-lead SOIC (208-mil)
   - 8-pad Ultra-thin DFN (2 x 3 x 0.6 mm)
   - 8-ball WLCSP (3 x 2 x 3 ball matrix)
   - Die in Wafer Form (DWF)