AT25QL321-DWF Datasheet PDF - Dialog Semiconductor

Introduction
The Adesto® AT25QL321 is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25QL321 is ideal for data storage as well, eliminating the need for additional data storage devices.

FEATUREs
• Single 1.7V - 2.0V Supply
• Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible
   • Supports SPI Modes 0 and 3
   • Supports Dual Output Read and Quad I/O Program and Read
   • Supports QPI Program and Read
   • 104 MHz* Maximum Operating Frequency
   • Clock-to-Output (tV1) of 6 ns
   • Up tp 65MB/S continuous data transfer rate
• Quad Enabled (factory default setting: see Section 6.4)
• Full Chip Erase
• Flexible, Optimized Erase Architecture for Code and Data Storage Applications
   • 0.6 ms Typical Page Program (256 Bytes) Time
   • 60 ms Typical 4-Kbyte Block Erase Time
   • 200 ms Typical 32-Kbyte Block Erase Time
   • 300 ms Typical 64-Kbyte Block Erase Time
• Hardware Controlled Locking of Protected Blocks via WP Pin
• 4K-bit secured One-Time Programmable Security Register
• Hardware Write Protection
• Serial Flash Discoverable Parameters (SFDP) Register
• Flexible Programming
   • Byte/Page Program (1 to 256 Bytes)
   • Dual or Quad Input Byte/Page Program (1 to 256 Bytes)
   • Accelerated programming mode via 9V ACC pin
• Erase/Program Suspend and Resume
• JEDEC Standard Manufacturer and Device ID Read Methodology
• Low Power Dissipation
   • 2µA Deep Power-Down Current (Typical)
   • 10µA Standby current (Typical)
   • 5mA Active Read Current (Typical)
• Endurance: 100,000 program/erase cycles (4KB, 32KB or 64KB blocks)
• Data Retention: 20 Years
• Industrial Temperature Range: -40°C to +85°C
• Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
   • 8-lead SOIC (208-mil)
   • 8-pad DFN (6 x 5 x 0.6 mm)
   • 24-ball Ball Grid Array (BGA)
   • 8 and 10-ball WLCSP, die Ball Grid Array (dBGA)
   • 8-pad USON(3 x 4 x 0.55mm)
   • Die in Wafer Form