PRODUCT DESCRIPTION
AWC6325 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 0.9 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands in less board area than two single band PAs.
FEATURES
• InGaP HBT Technology
• High Efficiency:
• 37 % @ POUT = +28 dBm
• 20 % @ POUT = +16 dBm
• 10 % @ POUT = +10 dBm
• Low Quiescent Current: 4 mA
• Internal Voltage Regulation
• Built-in Directional Coupler
• Common VMODE Control Line
• Suitable for SMPS and average power tracking systems with variable supply voltages
• APT can reduce TS.09 average power consumption more than 25%
• Reduced External Component Count
• Thin Package: 0.9 mm
• RoHS Compliant Package, 260 oC MSL-3
APPLICATIONS
• Dual-band Wireless Handsets and Data Devices
for CDMA/EVDO networks:
• Cellular BC 0 and 10
• PCS BC 1 and 14