PRODUCT DESCRIPTION
The AWT6224 addresses the demand for increased integration in dual-band handsets for EGSM network deployments. The small footprint 3 mm x 5 mm x 1 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs.
FEATURES
• InGaP HBT Technology
• High Efficiency:
20 % @ +16 dBm POUT
(without DC/DC Converter)
40 % @ maximum POUT
• Low Quiescent Current: 8 mA
• Internal Voltage Regulation
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• HSDPA Compliant
• RoHS Compliant Package, 250 oC MSL-3
APPLICATIONS
• WCDMA/HSPA 900/IMT Dual-Band Wireless
Handsets and Data Devices