AWT6301R Datasheet PDF - ANADIGICS

PRODUCT DESCRIPTION
   The AWT6301R meets the increasing demands for higher efficiency and linearity in CDMA1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.

FEATURES
• InGaP HBT Technology
• High Efficiency:
   40%, VMODE = 0 V
   41%, VMODE = +2.85 V (no mode switching)
• Low Quiescent Current: 50 mA
• Low Leakage Current in Shutdown Mode: <1 µA
• VREF = +2.85 V (+2.75 V Min Over Temp.)
• Optimized for a 50 Ω System
• Low Profile Surface Mount Package: 1.1mm
• CDMA 1XRTT, 1xEV-DO Compliant
• Pinout Enables Easy Phone Board Migration
   From 4 mm x 4 mm Package
• RoHS Compliant Package, 250 oC MSL-3

APPLICATIONS
• CDMA/EVDO Cell-band Wireless Handsets and
   Data Devices