PRODUCT DESCRIPTION
The AWT6314R meets the increasing demands for higher levels of integration in dual-band CDMA/PCS 1X handsets, while reducing board area requirements by 25 %. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a common VMODE pin. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
FEATURES
• Single Mode Operation: POUT ≤ +28 dBm
• High Efficiency: 54 % AMPS, 39 % CDMA
• Low Quiescent Current: 50 mA
• 25 % Package Size Reduction
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1.1 mm
• RoHS Compliant Package, 250 °C MSL-3
APPLICATIONS
• Dual-band Cellular/PCS CDMA Wireless
Handsets