BAS70 Datasheet PDF - Chip Integration Technology Corporation

■ Features
• Low current rectification and high speed switching.
• Small surface mount type.
• Up to 70mA current capability.
• Low forward voltage drop (VF = 1.00V typ. @15mA)
• Silicon epitaxial planar chip, metal silicon junction.
• High speed ( trr < 5 ns )
• Suffix "G" indicates Halogen-free part, ex.BAS70G.
• Lead-free parts for green partner, exceeds environmental
   standards of MIL-STD-19500 /228

■ Mechanical data
• Case : Molded plastic, SOT-23
• Terminals : Solder plated, solderable per
                    MIL-STD-750, Method 2026
• Mounting Position : Any
• Weight : Approximated 0.008 gram
• Epoxy:UL94-V0 rated flame retardant