BZT52B20 Datasheet PDF - SEC Electronics Inc.

FEATURES
• Planar die construction
• 350Mw power dissipation on ceramic PCB
• General purpose, medium current
• Ideally suited for automated assembly processes
• Available in lead free version

MECHANICAL DATA
• Case: SOD-123, Void-Free, Transfer-Molded Plastic.
• Finish: All External Surfaces are Corrosion Resistant.
• Maximum Case Temperature for Soldering Purpose:
   260°C for 10 Seconds
• Polarity: Cathode Indicated by Polarity Band
• Flammability Rating: UL94V-0
• Mounting Position: Any