BZX84C7V5 Datasheet PDF - SEC Electronics Inc.

FEATURES
• Planar Die Construction
• 300 mW Power Dissipation on FR-5 PCB
• General Purpose, Medium Current
• Ideally Suited for Automated Assembly Process
• Zener Voltages from 2.4V – 39V
• Ultra-Small Surface Mount Package Power Dissipation

MECHANICAL DATA
• Case: SOT-23, Molded Plastic
• Terminals: Solderable per MIL-STD-202,
   Method 208
• Polarity: See Diagrams
• Weight: 0.008 g (Approximately)
• Marking: Marking Code (See Table On Page 2)