C261X035Y1C Datasheet PDF - PANDUIT CORP.

specifications
Modular patch panels shall consist of a metal panel with molded snap-in faceplates which can be front releasable. Patch panels shall accept all Mini-Com® Modules for UTP, STP, fiber, or A/V applications and shall mount to standard 19" racks. Patch panels shall be available in 24 and 48-port standard density and 72-port high density. Angled patch panels shall be designed at an optimum angle to help route the cable.

APPLICATIONs
   Mini-Com® Modular Patch Panels are ideal for multi-media applications; they accept all Mini-Com® Modules, which can be accessed through the front of the panel to snap in and out for easy moves, adds, and changes.
Various styles and port densities available to fit most needs; labeling feature available on select styles. Angled patch panels are available for applications in which rack space is limited. The design allows cable to flow to each side of the rack, minimizing the need for horizontal cable managers and increasing the density of the rack space.