CB230WSG-ST Datasheet PDF - Chip Integration Technology Corporation

Features
• Ultra small surface mount package.
• Low forward voltage drop.
• Lead free in compliance with EU RoHS.

Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323ST
• Terminals : Solder plated, solderable per
                     MIL-STD-750, Method 2026
• Weight : Approximated 0.008 gram