DB1502 Datasheet PDF - DIOTEC Electronics Corporation

FEATURES
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
● ELECTRICALLY ISOLATED METAL CASE FOR MAXIMUM HEAT DISSIPATION
● UL RECOGNIZED - FILE #E124962
● RoHS COMPLIANT