DB3RI Datasheet PDF - TSC Corporation

Features
✧ Designed for through-Hole Device Type Mounting.
✧ Hermetically Sealed Glass.
✧ All external surface are corrosion resistant and
   terminals are readily solderable.
✧ High reliability glass passivation insuring parameter
   stability and protection against junction contamination.
✧ Pb free version and RoHS compliant

Mechanical Data
✧ Case :DO-35 Solder Hot Dip Tin (Sn) lead finish
✧ Terminal: Pure tin plated, lead free., solderable
   per MIL-STD-202, Method 208 guaranteed
✧ High temperature soldering guaranteed: 260°C/10s
✧ Marking : DB3/DB3TG
✧ Weight : 0.1255 gram (approximately)