DSS17-06CR Datasheet PDF - IXYS CORPORATION

Features
● Silicon chip on Direct-Copper-Bond substrate
   - High power dissipation
   - Isolated mounting surface
   - 2500V electrical isolation
● Low cathode to tab capacitance (<25pF)
● International standard package
● Planar passivated chips
● Very short recovery time
● Extremely low switching losses
● Low IRM-values
● Soft recovery behaviour
● Epoxy meets UL 94V-0
● Isolated and UL registered E153432

APPLICATIONs
● Antiparallel diode for high frequency
   switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode in converters
   and motor control circuits
● Rectifiers in switch mode power
   supplies (SMPS)
● Inductive heating
● Uninterruptible power supplies (UPS)
● Ultrasonic cleaners and welders

Advantages
● Avalanche voltage rated for reliable
   operation
● Soft reverse recovery for low EMI/RFI
● Low IRM reduces:
   - Power dissipation within the diode
   - Turn-on loss in the commutating switch