EMIF02-MIC02F2(2011) Datasheet PDF - STMicroelectronics

Description
The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

FEATUREs
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation: 1.42 mm x 0.92 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through integration and wafer level packaging

APPLICATIONs
Where EMI filtering in ESD sensitive equipment is required:
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards