ES1C Datasheet PDF - Daesan Electronics Corp.

Features
· For surface applications in order to optimize board space
· Low profile package
· Built-in strain relief, ideal for automated placement
· Super fast recovery time
· Glass passivated junction
· Plastic package has Unerwrites Laboratory
  Flammability Classification 94V-0
· Ideally suited for use in very high frequency switching power supplies, inverters and as free wheeling diodes
· Low forward voltage drop
· Glass passivated chip junction
· High temperature soldering guaranteed : 250℃/10 seconds, at terminals