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ES1C Datasheet PDF - Shenzhen Yixinwei Technology Co., Ltd.

ES1A image

Part Name
ES1C

Other PDF
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page
2 Pages

File Size
196 kB

MFG CO.
YIXIN
Shenzhen Yixinwei Technology Co., Ltd. YIXIN

serutaeF
◆ For surface mounted application
◆ Low profile package
◆ Built-in strain relief,
◆ Ideal for automated placement
◆ Easy pick and place
◆ Superfast recovery time for high efficiency
◆ Glass passivated chip junction
◆ High temperature soldering: 250°C/10 seconds at terminals
◆ Plastic material used carries Underwriters Laboratory Classification 94V-O


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