ES3ABF Datasheet PDF - Shanghai Yint Electronic Co., Ltd.

Features
● For surface mounted applications
● Low profile package
● Glass Passivated Chip Junction
● Superfast reverse recovery time
● Lead free in comply with EU RoHS 2011/65/EU directives

Mechanical Data
● Case:SMBF
● Terminals: Solderable per MIL-STD-750, Method 2026
● Approx.Weight: 57mg / 0.002oz