ES3AF-PJ Datasheet PDF - Dongguan Pingjingsemi Technology Co., Ltd,

FEATURES
✦ For surface mount applications
✦ Glass passivated chip junction
✦ Low profile package
✦ Superfast reverse recovery time
✦ Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA
✦ Case: SMAF molded plastic body
✦ Terminals: Solderable per MIL-STD- 750, Method 2026
✦ Weight: Approximated 0.027 grams