ES3C Datasheet PDF - Daesan Electronics Corp.

Features
· For surface applications in order optimize board space
· Low profile package
· Built-in strain relief, ideal for automated placement
· Super fast recovery time
· Plastic package has Unerwrites Laboratory Flammability Classification 94V-0
· Ideally suited for use in very high frequency switching power supplies, inverters and as free wheeling diodes
· Glass passivated chip junction
· High temperature soldering guaranteed: 250℃/10 seconds, at terminals