ES3C Datasheet PDF - Shenzhen Luguang Electronic Technology Co., Ltd

Features
◇ Glass passivated junction chip
◇ For surface mounted applications
◇ Low profile package
◇ Built-in strain relief
◇ Ideal for automated placement
◇ Easy pick and place
◇ Super fast recovery time for high efficiency
◇ Glass passivated chip junction
◇ High temperature soldering: 260°C/10 seconds at terminals
◇ Plastic material used carries Underwriters Laboratory Classification 94V-0