ES3C Datasheet PDF - DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD

Features
• Glass passivated chip junctions
• Ideal for automated placement
• Ultrafast reverse recovery time for high efficiency
• Low profile package
• High forward surge capability
• High temperature soldering: 260°C/10 seconds at terminals
• Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC