FDN352AP Datasheet PDF - VER SEMICONDUCTOR CO.,LIMITED

General Description
   These devices are well suited for low voltage and battery powered applications where low in-line power loss is needed in a very small outline surface mount package.

FEATUREs
■ –1.3 A, –30V RDS(ON) = 180 mΩ @ VGS = –10V
   –1.1 A, –30V RDS(ON) = 300 mΩ @ VGS = –4.5V
■ High performance trench technology for extremely low
   RDS(ON).
■ High power version of industry Standard SOT-23 package.
   Identical pin-out to SOT-23 with 30% higher power handling
   capability.

APPLICATIONs
■ Notebook computer power management