FESB8HT Datasheet PDF - General Semiconductor

FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ Glass passivated chip junction
♦ Low leakage, high voltage
♦ High surge current capability
♦ Superfast recovery time, for high efficiency
♦ High temperature soldering in accordance with CECC 802 / Reflow guaranteed