GPA1601(V_C10) Datasheet PDF - TSC Corporation

Features
◇ Glass passivated chip junction. 
◇ High efficiency, Low VF   
◇ High current capability 
◇ High reliability   
◇ High surge current capability 
◇ Low power lossy 
◇ Green compound with suffix "G" on packing code
   & prefix "G" on datecode.

Mechanical Data
◇ Cases: TO-220AC Molded plastic
◇ Epoxy: UL 94V-O rate flame retardant
◇ Terminal : Pure tin plated, lead free, solderable
   per MIL-STD-202, Method 208 guaranteed
◇ Polarity: As marked
◇ High temperature soldering guaranteed:
   260°C/10 seconds .16"(4.06mm) from case.
◇ Weight: 2.24 gram