Features
• Low profile surface mounted application in order to
optimize board space.
• High current capability.
• High surge capability.
• Glass passivated chip junction inside.
• Suffix "G" indicates Halogen-free part, ex.GS2AAG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.002 ounce, 0.055 gram