■ Features
• Low profile surface mounted application in order to
optimize board space.
• High current capability.
• High surge capability.
• Glass passivated chip junction inside.
• Suffix "G" indicates Halogen-free part, ex.GS2AASG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMAS
• Terminals :
Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : Approximated 0.08 gram