HFA30PA60C Datasheet PDF - Thinki Semiconductor Co., Ltd.

GENERAL DESCRIPTION
HFA30PA60C using the lastest FRED FAB process(planar passivation chip) with ultrafast and soft recovery characteristic.

PRODUCT FEATURE
• Ultrafast Recovery Time
• Soft Recovery Characteristics
• Low Recovery Loss
• Low Forward Voltage
• High Surge Current Capability
• Low Leakage Current

APPLICATION
• Freewheeling, Snubber, Clamp
• Inversion Welder
• PFC
• Plating Power Supply
• Ultrasonic Cleaner and Welder
• Converter & Chopper
• UPS