HPR711 Datasheet PDF - C AND D TECHNOLOGIES

DESCRIPTION
The HPR7XX Series provides high power densities where space is critical. The small SIP package measures only 2.2" x .3" x .4" (56 x 9 x 10 mm). Designed for high density boards, the package is non-conductive, which presents advantages over painted metal enclosures.

FEATURES
● EFFICIENCY >80%
● SIP PACKAGE
● HIGH POWER DENSITY: > 16 WATTS/INCH3
● LOW COST
● SINGLE AND DUAL OUTPUTS
● INTERNAL INPUT AND OUTPUT FILTERING
● SIX-SIDED SHIELDING