IRFL9014 Datasheet PDF - VER SEMICONDUCTOR CO.,LIMITED

Description
   The SOT-223 package is designed for surface-mounting using vapor phase, infrared, or wave soldering techniques. Its unique package design allows for easy automatic pickand-place as with other SOT or SOP packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of greater than 1.25 W is possible in a typical surface mount application.

FEATUREs
• VDS (V) = -60V
• ID = -8A (VGS = -10V)
• RDS(ON) < 62mΩ (VGS = -10V)