LLDB3TGL1(V_B09) Datasheet PDF - TSC Corporation

Features
◇ Designed for through-Hole Device Type Mounting.
◇ Hermetically Sealed Glass.
◇ All external suface are corrosion resistant and terminals are readily solderable.
◇ High reliability glass passivation insuring parameter stability and protection against junction contamination.
◇ Pb free version and RoHS compliant