MA4P7441F-1091T(V2) Datasheet PDF - M/A-COM Technology Solutions, Inc.

Description and Applications
The MA4P7441F-1091T is a surface mountable PIN diode in a Non-Magnetic ( patent pending ) Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM’s new non- magnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN diode that is full face bonded on both the cathode and anode of the chip to maximize surface area for lower electrical and thermal resistance. The MA4P7441F-1091T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. This MA4P7441F-1091T Non-Magnetic device is similar in electrical performance to the MA4P4001F-1091T Magnetic part number.

FEATUREs
• Non-Magnetic Package Suitable for MRI
   Applications
• Rectangular MELF SMQ Ceramic Package
• Hermetically Sealed
• Lower Rs for Lower Series Loss
• Longer τL for Lower Intermodulation Distortion
• Lower Cj for Higher Series Isolation
• Higher Average Incident Power Handling
   Capability