MB105F Datasheet PDF - PACELEADER INDUSTRIAL

FEATURES
● Low profile space
● Ideal for automated placement
● Glass passivated chip junction
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering： 260℃/10 seconds at terminals
● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC