MBRF10100CT Datasheet PDF - Chip Integration Technology Corporation

Features
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.MBRF1040CTG.
• Lead-free parts meet environmental standards of
   MIL-STD-19500 /228

Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC ITO-220AB molded plastic body over
              passivated chip
• Lead : Axial leads, solderable per MIL-STD-202,
              Method 208 guranteed
• Polarity: Color band denotes cathode end
• Mounting Position : Any
• Weight : Approximated 2.25 gram