MLF2012C150MT(2007) Datasheet PDF - TDK Corporation

FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of compact circuits with high packing density.
• Excellent solderability and high heat resistance permits either flow or reflow soldering.
• The products contain no lead and also support lead-free soldering.
• It is a product conforming to RoHS directive.

APPLICATIONS
    Digital cellular phone, car audio, TV, personal computers, or various electronic appliances.