MMSZ5234B Datasheet PDF - UN Semiconducctor INC

Features
✦ Planar Die Construction
✦ Ultra-Small Surface Mount Package
✦ General purpose, Medium Current
✦ 350mW Power Dissipation On Ceramic PBC
✦ Ideally Suited for Automated Assembly Processes

Mechanical Data
✦ Case: SOD-123
✦ Molding Compound Flammability Rating : UL 94V-O
✦ Quantity Per Reel : 3,000pcs
✦ Lead Finish : Lead Free