MQFP-D Datasheet PDF - STATS ChipPAC, Ltd.
Part Name
MQFP-D
Description
Other PDF
no available.
PDF
page
2 Pages
File Size
77.2 kB
MFG CO.
STATS ChipPAC, Ltd.
DESCRIPTION
STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack (MQFP-d) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by an embedded anodized aluminum heat spreader which is dropped in during the mold process. This process allows the use of standard leadframe while offering an added margin of thermal performance for high power applications. The QFP-d package offers 30% improvement (typical) in thermal performance over standard MQFP packages.
FEATURES
• Body Sizes: 14 x 14mm to 32 x 32mm
• Package Height: 2.0mm to 3.4mm (same as QFP)
• Lead Counts: 64L to 240L
• Lead Pitch: 0.80mm to 0.50mm
• Moisture Sensitivity: JEDEC Level 3
• Wide range of open tool leadframe and die pad sizes
available
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• FPGA
• PLD
• High speed logic, high power microprocessors /
controllers
• 3D graphics, telecom, wireless, audio, CPU / GUI
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