MQFP Datasheet PDF - STATS ChipPAC, Ltd.
Part Name
MQFP
Description
Other PDF
no available.
PDF
page
2 Pages
File Size
82.5 kB
MFG CO.
STATS ChipPAC, Ltd.
DESCRIPTION
STATS ChipPAC’s Metric Quad Flat Pack (MQFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The MQFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the MQFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.
FEATURES
• Body Sizes: 10 x 10mm to 32 x 32mm
• Package Height: 2.0 mm to 3.4mm
• Lead Counts: 44L to 240L
• Lead Pitch: 0.80mm to 0.50mm
• Wide range of open tool leadframe and die pad
sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green material sets available
• Copper and alloy leadframes available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic / Microprocessors / Controllers
• Multimedia, PC Chipsets, Others
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