MT28F322D18FH-704B Datasheet PDF - Micron Technology

GENERAL DESCRIPTION
The MT28F322D20 and MT28F322D18 are highperformance, high-density, nonvolatile Flash memory solutions that can significantly improve system performance. This new architecture features a two-memory-bank configuration that supports dual-bank operation with no latency.

FEATURES
• Flexible dual-bank architecture
    – Support for true concurrent operation with zero latency
    – Read bank a during program bank b and vice versa
    – Read bank a during erase bank b and vice versa
• Basic configuration: Seventy-one erasable blocks
    – Bank a (8Mb for data storage)
    – Bank b (24Mb for program storage)
• VCC, VCCQ, VPP voltages
    – 1.70V (MIN), 1.90V (MAX) VCC, VCCQ (MT28F322D18 only)
    – 1.80V VCC, VCCQ (MIN); 2.20V VCC (MAX)and 2.25V VCCQ (MAX) (MT28F322D20 only)
    – 0.9V (TYP) VPP (in-system PROGRAM/ERASE)
    – 12V ±5% (HV) VPP tolerant (factory programming compatibility)
• Random access time: 70ns/80ns @ 1.70V VCC
• Burst Mode read access (MT28F322D20)
    – MAX clock rate: 54 MHz (tCLK = 18.5ns)
    – Burst latency: 70ns @ 1.80V VCC and 54 MHz
    – tACLK: 17ns @ 1.80V VCC and 54 MHz
• Page Mode read access1
    – Eight-word page
    – Interpage read access: 70ns/80ns @ 1.80V
    – Intrapage read access: 30ns @ 1.80V
• Low power consumption (VCC = 2.20V)
    – Asynchronous READ < 15mA (MAX)
    – Standby < 50µA
    – Automatic power saving feature (APS)
• Enhanced write and erase suspend options
    – ERASE-SUSPEND-to-READ within same bank
    – PROGRAM-SUSPEND-to-READ within same bank
    – ERASE-SUSPEND-to-PROGRAM within same bank
• Dual 64-bit chip protection registers for security purposes
• Cross-compatible command support
    – Extended command set
    – Common flash interface
• PROGRAM/ERASE cycle
    – 100,000 WRITE/ERASE cycles per block