MXP18-C Datasheet PDF - Microsemi Corporation
Part Name
MXP18-C
Description
Other PDF
no available.
PDF
page
1 Pages
File Size
32 kB
MFG CO.
Microsemi Corporation
Features
• Dielectrically Isolated Diodes
• Aluminum Wire bondable
• Backside Metallization - Gold
• Die Attach methods: Eutectic or Epoxy
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