NVMJST3D3N04C Datasheet PDF - ON Semiconductor

Features
 Small Footprint (5x7 mm) for Compact Design
 Low RDS(on) to Minimize Conduction Losses
 Low QG and Capacitance to Minimize Driver Losses
 TCPAK57 5x7 Top Cool Package
 AEC−Q101 Qualified and PPAP Capable
 These Devices are Pb−Free and are RoHS Compliant