P444MFJ3.3A Datasheet PDF - Shanghai Leiditech Electronic Technology Co., Ltd

Features
• For surface mounted applications in order to optimize board space.
• Ultra thin profile package for space constrained utilization.
• Package suitable for automated handling
• Low inductance
• High temperature soldering : 260℃/10 seconds at terminals
• Lead free in compliance with EU RoHS 2011/65/EU directive.
• Green molding compound as per IEC61249 Std.(Halogen Free)

Mechanical Data
• Case: SOD-123FL, Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Approx. Weight: 0.0006 ounces, 0.0173 grams
• Standrad package: 8mm tape (EIA-481)