QFN Datasheet PDF - STATS ChipPAC, Ltd.
Part Name
QFN
Description
Other PDF
no available.
PDF
page
2 Pages
File Size
415.2 kB
MFG CO.
STATS ChipPAC, Ltd.
DESCRIPTION
STATS ChipPAC’s Quad Flat No-Lead (QFN) and Dual Flat No-Lead (DFN) package offering includes the QFNs (saw singulated), QFNp (punch singulated), XQFN, UQFN, WQFN, and QFN-dr. These are leadframe based, plastic encapsulated, chip scale packages in single mold cavity format (punch singulated) or molded array format (saw singulated).
FEATURES
• Body sizes: 2 x 2 to 12 x 12mm
• Lead pitch: 0.40, 0.50, 0.65 and 0.80mm
• Custom lead/pitch configurations available
• Package profile heights: 0.45, 0.50, 0.75, 0.85 and
0.90mm
• Option for non-exposed die pad
• Green materials set
• Option for PbSn, 100% matte Sn or PPF
• Small chip scale design offers 50% reduction in board
space (16L TSSOP vs. 16L QFN)
• 33% weight reduction (in 16L TSSOP vs. 16L QFN)
• Excellent thermal & electrical performance
• Full in-house package and leadframe design capability
• Full in-house assembly and test capability
• Full in-house electrical, thermal and mechanical
simulation and measurement capability
• Wide range of open tool leadframe and die pad sizes
available
• JEDEC standard compliant (XQFN, UQFN, WQFN, VQFN)
APPLICATIONS
• RF
• Power management
• Discretes
• Analog/Linear
• Logic
• Applications requiring enhanced electrical and thermal
performance and reduced package size, thickness and
weight
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