QFP-EP Datasheet PDF - STATS ChipPAC, Ltd.
Part Name
QFP-EP
Description
Other PDF
no available.
PDF
page
2 Pages
File Size
93.4 kB
MFG CO.
STATS ChipPAC, Ltd.
DESCRIPTION
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep). These enhanced thermal packages are made possible by deep downset die pad leadframe design combined with well controlled low loop wirebonding and package warpage control during the molding process.
FEATURES
• Body Sizes: 7 x 7mm to 24 x 24mm
• Package Height: 1.0mm (TQFP-ep) and 1.4mm
(LQFP-ep)
• Lead Counts: 32L to 216L
• Lead Pitch: 0.40mm to 0.80mm
• Wide range of open tool leadframe and die pad
sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic, Microprocessors/Controllers
• Multimedia, PC Chipsets, Others
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