RC24-3-01 Datasheet PDF - II-VI Marlow, Inc.

AVAILABLE MODIFICATIONS
   Solid-state reliability.
   Built with high temperature solder with the ability to withstand
   higher assembly processing temperatures for short periods of
   time (<160°C).
   Superior nickel diffusion barriers on elements.
   High strength for rugged environment.
   Porched configuration for enhanced leadwire strength.
   RTV sealing available (Optional).
   Lapped option available for multiple module applications.