S-DSK15 Datasheet PDF - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile package
● Ideal for automated placement
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC
● AEC-Q101 qualified

Mechanical Date
● Case: SOD-123FL molded plastic
● Terminals: Solder plated, solderable per
   JESD22-B102D
● Polarity: Laser band denotes cathode end