S1AF Datasheet PDF - First Silicon Co., Ltd

FEATURES
◾ For surface mounted applications
◾ Low profile package
◾ Glass Passivated Chip Juntion
◾ Easy to pick and place
◾ Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA
◾ Case: SMAF
◾ Terminals: Solderable per MIL-STD-750, Method 2026
◾ Approx. Weight: 27mg 0.00086oz