SIS30SA1L Datasheet PDF - Silicon Supplies

Features:
• Ultra-low leakage current
• Low forward voltage
• 30V breakdown voltage
• Guard-ring for over-voltage protection
• High reliability tested grades & matched
   characteristic options.

Supply Formats:
• Default – Die in Waffle Pack (400 per tray capacity)
• Sawn Wafer on Tape – By specific request
• Unsawn Wafer – By specific request
• Die Thickness <> 100µm(4 Mils) – On request
• With additional electrical selection – On request