SK36B Datasheet PDF - Chip Integration Technology Corporation

Features
• Electrostatic discharge (ESD) test under IEC6100-4-2
   standard >16ΚV(SK32B~SK36B).
   standard >10ΚV(SK310B~SK320B).
• Low profile surface mounted application in order to
   optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.SK32BG.
• Lead-free parts meet environmental standards of
   MIL-STD-19500 /228

■ Mechanical data
• Case : Molded plastic, DO-214AA / SMB
• Terminals : Solder plated, solderable per
   MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.003 ounce, 0.091 gram
• Epoxy:UL94-V0 rated flame retardant